posted on 2017-05-24, 00:00authored byTheodore
E. G. Alivio, Diane G. Sellers, Hasti Asayesh-Ardakani, Erick J. Braham, Gregory A. Horrocks, Kate E. Pelcher, Ruben Villareal, Lucia Zuin, Patrick J. Shamberger, Raymundo Arróyave, Reza Shahbazian-Yassar, Sarbajit Banerjee
The
thermally driven orders-of-magnitude modulation of resistance
and optical transmittance observed in VO2 makes it an archetypal
first-order phase transition material and underpins functional applications
in logic and memory circuitry, electromagnetic cloaking, ballistic
modulation, and thermochromic glazing to provide just a few representative
examples. VO2 can be reversibly switched from an insulating
to a metallic state at an equilibrium transition temperature of 67
°C. Tuning the phase diagram of VO2 to bring the transition
temperature closer to room temperature has been a longstanding objective
and one that has tremendous practical relevance. Substitutional incorporation
of dopants has been the most common strategy for modulating the metalinsulator
transition temperature but requires that the dopants be incorporated
during synthesis. Here we demonstrate a novel postsynthetic diffusive
annealing approach for incorporating interstitial B dopants within
VO2. The postsynthetic method allows for the transition
temperature to be programmed after synthesis and furthermore represents
an entirely distinctive mode of modulating the phase diagram of VO2. Local structure studies in conjunction with density functional
theory calculations point to the strong preference of B atoms for
tetrahedral coordination within interstitial sites of VO2; these tetrahedrally coordinated dopant atoms hinder the rutile
→ monoclinic transition by impeding the dimerization of V–V
chains and decreasing the covalency of the lattice. The results suggest
that interstitial dopant incorporation is a powerful method for modulating
the transition temperature and electronic instabilities of VO2 and provides a facile approach for postsynthetic dopant incorporation
to reach a switching temperature required for a specific application.