am9b09578_si_002.mp4 (16.23 MB)
Download fileTransformation of 2D Planes into 3D Soft and Flexible Structures with Embedded Electrical Functionality
media
posted on 2019-08-30, 18:46 authored by Hyunmin Moon, Namsun Chou, Hee Won Seo, Kyeongyeon Lee, Jinhee Park, Sohee KimThree-dimensional
(3D) structures composed of flexible and soft
materials have been in demand for implantable biomedical devices.
However, the fabrication of 3D structures using microelectromechanical
system (MEMS) techniques has limitations in terms of the materials
and the scale of the structures. Here, a technique to selectively
bond polydimethylsiloxane (PDMS) and parylene-C by plasma treatment
is reported, with which two-dimensional structures that are fabricated using MEMS techniques are
turned into 3D structures by the inflation of selectively non-bonded
patterns. The bonding strength and the bonding mechanism were analyzed
by mechanical tests and chemical analyses, respectively. We fabricated
soft and flexible 3D structures with various patterns and dimensions,
even with embedded electrical functions, including light emitting
diodes and electrocorticogram electrodes. Based on these results,
the flexible, soft, and MEMS-capable 3D structures that are obtained
by the developed selective bonding technique are promising for applications
in a wide range of biomedical applications.