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Magnetic Field Effects on Copper Metal Deposition from Copper Sulfate Aqueous Solution

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posted on 08.05.2014, 00:00 by Chikako Udagawa, Aya Maeda, Akio Katsuki, Syou Maki, Shotaro Morimoto, Yoshifumi Tanimoto
Effects of a magnetic field (≤0.5 T) on electroless copper metal deposition from the reaction of a copper sulfate aqueous solution and a zinc thin plate were examined in this study. In a zero field, a smooth copper thin film grew steadily on the plate. In a 0.38 T field, a smooth copper thin film deposited on a zinc plate within about 1 min. Then, it peeled off repeatedly from the plate. The yield of consumed copper ions increased about 2.1 times compared with that in a zero field. Mechanism of this magnetic field effect was discussed in terms of Lorentz force- and magnetic force-induced convection and local volta cell formation.

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