Flexible
Conductive Polyimide Fiber/MXene Composite
Film for Electromagnetic Interference Shielding and Joule Heating
with Excellent Harsh Environment Tolerance
posted on 2021-10-15, 19:38authored byKang Sun, Fan Wang, Wenke Yang, Hu Liu, Caofeng Pan, Zhanhu Guo, Chuntai Liu, Changyu Shen
The development of flexible MXene-based
multifunctional composites
is becoming a hot research area to achieve the application of conductive
MXene in wearable electric instruments. Herein, a flexible conductive
polyimide fiber (PIF)/MXene composite film with densely stacked “rebar-brick-cement”
lamellar structure is fabricated using the simple vacuum filtration
plus thermal imidization technique. A water-soluble polyimide precursor,
poly(amic acid), is applied to act as a binder and dispersant to ensure
the homogeneous dispersion of MXene and its good interfacial adhesion
with PIF after thermal imidization, resulting in excellent mechanical
robustness and high conductivity (3787.9 S/m). Owing to the reflection
on the surface, absorption through conduction loss and interfacial/dipolar
polarization loss inside the material, and the lamellar structure
that is beneficial for multiple reflection and scattering between
adjacent layers, the resultant PIF/MXene composite film exhibits a
high electromagnetic interference (EMI) shielding effectiveness of
49.9 dB in the frequency range of 8.2–12.4 GHz. More importantly,
its EMI shielding capacity can be well maintained in various harsh
environments (e.g., extreme high/low temperature, acid/salt solution,
and long-term cyclic bending), showing excellent stability and durability.
Furthermore, it also presents fast, stable, and long-term durable
Joule heating performances based on its stable and excellent conductivity,
demonstrating good thermal deicing effects under actual conditions.
Therefore, we believe that the flexible conductive PIF/MXene composite
film with excellent conductivity and harsh environment tolerance possesses
promising potential for electromagnetic wave protection and personal
thermal management.