am505286b_si_003.mp4 (47.89 MB)
Elastomeric Angled Microflaps with Reversible Adhesion for Transfer-Printing Semiconductor Membranes onto Dry Surfaces
media
posted on 2014-11-12, 00:00 authored by Byungsuk Yoo, Sungbum Cho, Seungwan Seo, Jongho LeeRecent research for unconventional
types of electronics has revealed
that it is necessary to transfer-print high-performance microelectronic
devices onto diverse surfaces, including flexible or stretchable surfaces,
to relieve mechanical constraints associated with conventional rigid
electronics. Picking up and placing ultrathin microdevices without
damage are critical procedures for the successful manufacture of various
types of unconventional electronics. This paper introduces elastomeric
angled microflaps that have reversible adhesion; i.e., they generate
higher adhesion for picking up and low adhesion for printing because
of their structural shapes and viscoelastic material properties. The
microstructured stamp, fabricated in relatively simple ways, enables
simultaneous transfer-printing of multiple silicon membranes that
have irregular shapes in sizes ranging from micrometer to millimeter
scales. Mechanical characterizations by experiment reveal optimal
parameters for picking up and placing ultrathin membranes on a programmable
custom-built microstage. Further refinement of the structures and
materials should be useful for many applications requiring the microassembly
of multiple semiconductor membranes in diverse shapes and sizes on
dry surfaces without the aid of liquid adhesives.
History
Usage metrics
Categories
Keywords
stretchable surfacessilicon membranesMechanical characterizationselectronicultrathin microdevicesReversible Adhesionadhesionsemiconductor membranestypeDry SurfacesRecent researchultrathin membranesElastomeric Angled Microflapsmicrostructured stampmillimeter scalesmaterial propertieselastomeric angled microflaps
Licence
Exports
RefWorks
BibTeX
Ref. manager
Endnote
DataCite
NLM
DC