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Wafer-Scale Assembly of Highly Ordered Semiconductor Nanowire Arrays by Contact Printing

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journal contribution
posted on 03.04.2020, 17:48 by Zhiyong Fan, Johnny C. Ho, Zachery A. Jacobson, Roie Yerushalmi, Robert L. Alley, Haleh Razavi, Ali Javey
Controlled and uniform assembly of “bottom-up” nanowire (NW) materials with high scalability presents one of the significant bottleneck challenges facing the integration of nanowires for electronic applications. Here, we demonstrate wafer-scale assembly of highly ordered, dense, and regular arrays of NWs with high uniformity and reproducibility through a simple contact printing process. The assembled NW pitch is shown to be readily modulated through the surface chemical treatment of the receiver substrate, with the highest density approaching ∼8 NW/μm, ∼95% directional alignment, and wafer-scale uniformity. Such fine control in the assembly is attained by applying a lubricant during the contact printing process which significantly minimizes the NW−NW mechanical interactions, therefore enabling well-controlled transfer of nanowires through surface chemical binding interactions. Furthermore, we demonstrate that our printing approach enables large-scale integration of NW arrays for various device structures on both rigid silicon and flexible plastic substrates, with a controlled semiconductor channel width ranging from a single NW (∼10 nm) up to ∼250 μm, consisting of a parallel array of over 1250 NWs and delivering over 1 mA of ON current.