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Thin Film Receiver Materials for Deterministic Assembly by Transfer Printing

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journal contribution
posted on 10.06.2014, 00:00 by Tae-il Kim, Mo Joon Kim, Yei Hwan Jung, Hyejin Jang, Canan Dagdeviren, Hsuan An Pao, Sang June Cho, Andrew Carlson, Ki Jun Yu, Abid Ameen, Hyun-joong Chung, Sung Hun Jin, Zhenqiang Ma, John A. Rogers
We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelectronics, and other areas of interest.

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