The gap state caused by the metal is the main factor
causing the
high resistance between the metal and the semiconductor, which also
hinders the electrical modulation at the heterojunction interface.
This issue can be alleviated by inserting an insulating layer between
the metal and the semiconductor. However, theoretical studies on the
effect of the insertion layer on the interface and transport properties
are not sufficient. In this study, we constructed a metal–insulator–semiconductor
(MIS) heterojunction by vertically stacking metal, insertion layer
(graphene, hBN), and black phosphorus. A tunable interfacial barrier
was achieved through van der Waals contacts, which selectively forms
Ohmic or Schottky contacts. It has also been found that uniaxial strain
can effectively reduce the tunneling barrier, especially for Cu and
Pt. Additionally, the insertion layer can reduce the effective mass
of holes, which facilitates the formation of p-type semiconductors
and enhances the transport properties. By adjusting the thickness
of graphene, the polarity of the carriers can be altered and electrical
modulation can be achieved. In addition, we have investigated the
mechanism of interlayer interactions underlying the process. This
work provides a comprehensive understanding of insertion effects in
MIS, paving the way for potential technological applications based
on vertically stacked nanomaterials.