A homogeneous composite of aligned
carbon nanotubes (CNTs) and
copper was fabricated by combining copper nanoparticle functionalization
with the CNT dry-spinning technology. The copper nanoparticles decorating
the CNTs enabled high-yield copper electroplating inside the CNT yarn.
Our homogeneous CNT/Cu composite had a weight density 38% lower than
copper, yet had a 2.8-fold lower-temperature coefficient of resistance
(TCR), 3.6 times higher specific current capacity (ampacity), and
almost the same specific conductivity. The high alignment of the CNTs
and the firm contacts at the CNT/Cu interface contributed to maximizing
the conductivity by inducing elastic scattering of free electrons,
leading to lower TCR and higher specific ampacity. The firm contacts
at the CNT/Cu interface also enabled effective load transfer between
the CNTs and copper matrix and reinforced the tensile strength of
copper by a factor of 3.7. The smaller TCR and reinforced tensile
properties of the homogeneous CNT/Cu composite make it promising for
thin, lightweight wiring materials for small, lightweight motors and
coils.