Supramolecular Self-Assembly in a Sub-micrometer Electrodic Cavity: Fabrication of Heat-Reversible π‑Gel Memristor
journal contributionposted on 25.08.2017, 00:00 by Lei Zhang, Songlin Li, Marco A. Squillaci, Xiaolan Zhong, Yifan Yao, Emanuele Orgiu, Paolo Samorì
The use of biomimetic approaches toward the production of nonsolid yet functional architectures holds potential for the emergence of novel device concepts. Gels, in particular those obtained via self-assembly of π-conjugated molecules, are dynamic materials possessing unique (opto)electronic properties. Their adaptive nature imparts unprecedented responsivity to various stimuli. Hitherto, a viable device platform to electrically probe in situ a sol–gel transition is still lacking. Here we describe the fabrication of a sub-micrometer electrodic cavity, which enables low-voltage electrical operation of π-gels. Thanks to the in situ supramolecular self-assembly of the π-gelator occurring within the cavity, we conceived a novel gel-based memristor whose sol–gel transition is reversible and can be controlled via heating and dc bias. This work opens perspectives toward the fabrication of a novel generation of nonsolid multiresponsive devices.
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novel device conceptsadaptive naturenovel generationπ- gelatorSupramolecular Self-Assemblynonsolid multiresponsive devicesfabricationbiomimetic approachesSub-micrometer Electrodic CavityGeldc biassupramolecular self-assemblysub-micrometer electrodic cavitydevice platformtransitionnovel gel-based memristor