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Supramolecular Self-Assembly in a Sub-micrometer Electrodic Cavity: Fabrication of Heat-Reversible π‑Gel Memristor
journal contribution
posted on 2017-08-25, 00:00 authored by Lei Zhang, Songlin Li, Marco A. Squillaci, Xiaolan Zhong, Yifan Yao, Emanuele Orgiu, Paolo SamorìThe use of biomimetic approaches
toward the production of nonsolid
yet functional architectures holds potential for the emergence of
novel device concepts. Gels, in particular those obtained via self-assembly
of π-conjugated molecules, are dynamic materials possessing
unique (opto)electronic properties. Their adaptive nature imparts
unprecedented responsivity to various stimuli. Hitherto, a viable
device platform to electrically probe in situ a sol–gel transition
is still lacking. Here we describe the fabrication of a sub-micrometer
electrodic cavity, which enables low-voltage electrical operation
of π-gels. Thanks to the in situ supramolecular self-assembly
of the π-gelator occurring within the cavity, we conceived a
novel gel-based memristor whose sol–gel transition is reversible
and can be controlled via heating and dc bias. This work opens perspectives
toward the fabrication of a novel generation of nonsolid multiresponsive
devices.
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novel device conceptsadaptive naturenovel generationπ- gelatorSupramolecular Self-Assemblynonsolid multiresponsive devicesfabricationbiomimetic approachesSub-micrometer Electrodic CavityGeldc biassupramolecular self-assemblysub-micrometer electrodic cavitydevice platformtransitionnovel gel-based memristor
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