Metallized
polymer films (MPFs) with superior self-healing properties
are extremely attractive for application in energy storage capacitors.
Self-healing behaviors allow MPFs to keep insulating between the local
electrical breakdown region and the electrode, thereby reserving long-term
operational viability of the capacitors. Polyimide (PI) is a type
of well-developed polymer material with excellent mechanical and thermal
stabilities, but it is deficient in intrinsic self-healing capabilities.
This work reports a facile surface engineering strategy to endow metalized
PI films with self-healing capabilities. By simple immersion of bare
PI films in the solution of epoxy resin (ER) accompanied by curing
of ER, PI films impregnated with ER (P–E films) not only show
enhanced dielectric characteristics but also obtain excellent self-healing
abilities upon multiple cycles of electrical breakdowns, even at a
high temperature. For example, in comparison to bare PI films, PI
films impregnated in ER solution with a solid content of 1 wt % (P–1%E)
display improved initial Weibull breakdown strength (αb1 of 353.0 versus 310.9 kV/mm), maximum discharging energy density
(Ud of 2.1836 versus 0.8254 J/cm3), and charging/discharging efficiency (η of 95.72 versus 55.19%)
at 150 °C. After 5 breakdown cycles, P–1%E films could
maintain a much higher breakdown strength (αb5 of
338.1 versus 21.3 kV/mm). When subjected to a constant electrical
strength of 350 kV/mm at 150 °C, P–1%E films show merely
<6% decline in both Ud and η
values after 5 breakdown cycles. On the contrary, bare PI films would
undergo dramatic performance decay after 1 or 2 breakdowns under similar
conditions. In view of their outstanding self-healing properties at
a high temperature, P–E films can serve as a promising candidate
to fabricate thermally stable MPF capacitors for long-term operation.