American Chemical Society
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Metallized Skeleton of Polymer Foam Based on Metal–Organic Decomposition for High-Performance EMI Shielding

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journal contribution
posted on 2022-01-07, 09:16 authored by Si-Yuan Liao, Gang Li, Xiao-Yun Wang, Yan-Jun Wan, Peng-Li Zhu, You-Gen Hu, Tao Zhao, Rong Sun, Ching-Ping Wong
Highly conductive polymer foam with light weight, flexibility, and high-performance electromagnetic interference (EMI) shielding is highly desired in the fields of aerospace, communication, and high-power electronic equipment, especially in the board-level packaging. However, traditional technology for preparing conductive polymer foam such as electroless plating and electroplating involves serious pollution, a complex fabrication process, and high cost. It is urgent to develop a facile method for the fabrication of highly conductive polymer foam. Herein, we demonstrated a lightweight and flexible silver-wrapped melamine foam (Ag@ME) via in situ sintering of metal–organic decomposition (MOD) at a low temperature (200 °C) on the ME skeleton modified with poly­(ethylene imine). The Ag@ME with a continuous 3D conductive network exhibits good compressibility, an excellent conductivity of 158.4 S/m, and a remarkable EMI shielding effectiveness of 63 dB in the broad frequency of 8.2–40 GHz covering X-, Ku-, K-, and Ka-bands, while the volume content is only 2.03 vol %. The attenuation mechanism of Ag@ME for EM waves is systematically investigated by both EM simulation and experimental analysis. Moreover, the practical EMI shielding application of Ag@ME in board-level packaging is demonstrated and it shows outstanding near-field shielding performance. This novel strategy for fabrication of highly conductive polymer foam with low cost and non-pollution could potentially promote the practical applications of Ag@ME in the field of EMI shielding.