am7b05266_si_001.pdf (1.79 MB)
Low-Ceiling-Temperature Polymer Microcapsules with Hydrophobic Payloads via Rapid Emulsion-Solvent Evaporation
journal contribution
posted on 2017-05-25, 00:00 authored by Shijia Tang, Mostafa Yourdkhani, Catherine M. Possanza Casey, Nancy R. Sottos, Scott R. White, Jeffrey S. MooreWe
report a microencapsulation procedure based on rapid solvent evaporation
to prepare microcapsules with hydrophobic core materials and low-ceiling-temperature
polymer shell wall of cyclic poly(phthalaldehyde) (cPPA). We use and
compare microfluidic and bulk emulsions. In both methods, rapid solvent
evaporation following emulsification resulted in kinetically trapped
core–shell microcapsules, whereas slow evaporation resulted
in acorn morphology. Through the systematic variation of encapsulation
parameters, we found that polymer-to-core weight ratios higher than
1 and polymer concentrations higher than 4.5 wt % in the oil phase
were required to obtain a core–shell structure. This microencapsulation
procedure enabled the fabrication of microcapsules with high core
loading, controlled size, morphology, and stability. This procedure
is versatile, allowing for the encapsulation of other hydrophobic
core materials, i.e., mineral oil and organotin catalyst, or using
an alternative low-ceiling-temperature polymer shell wall, poly(vinyl tert-butyl carbonate sulfone).
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evaporationmicrocapsulemorphologylow-ceiling-temperature polymer shell wallalternative low-ceiling-temperature polymer shell wallmicroencapsulation procedurebutyl carbonate sulfoneLow-Ceiling-Temperature Polymer Microcapsulescore materialsRapid Emulsion-Solvent Evaporationpolymer-to-core weight ratios
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