Atomically thin two-dimensional (2D) semiconductors like
transition
metal dichalcogenides (TMDs) show great promise as new channel materials
for next-generation electronic devices. However, their practical implementation
is hampered by the lack of suitable gate dielectrics and interfaces
that minimize interface and oxide traps. Here, we introduce a novel
strategy to improve the dielectric interface of tungsten diselenide
(WSe2) p-type field-effect transistors (p-FETs) by integrating
a native oxide, tungsten oxide (WOx),
as an interlayer into a high-κ hafnium dioxide (HfO2) back gate stack. The WOx interlayer
serves as both a doping layer to adjust the threshold voltage (VTH) and an interfacial layer to improve the
WSe2–HfO2 interface. The subthreshold
swing (SS) in long-channel p-FETs with this gate stack can achieve
a near-ideal value (∼68 mV/dec), and hysteresis improves significantly
within a 6 V gate sweep range. This work establishes a pathway for
high-κ dielectric integration in high-performance 2D electronics.