posted on 2020-04-03, 17:36authored byAlison C. Twitchett-Harrison, Timothy J. V. Yates, Simon B. Newcomb, Rafal E. Dunin-Borkowski, Paul A. Midgley
Semiconductor device structures are becoming increasingly three-dimensional at the nanometer scale. A key issue that must be addressed
to enable future device development is the three-dimensional mapping of dopant distributions, ideally under “working conditions”. Here we
demonstrate how a combination of electron holography and electron tomography can be used to determine quantitatively the three-dimensional
electrostatic potential in an electrically biased semiconductor device with nanometer spatial resolution.