posted on 2021-08-11, 19:09authored byDarshan M. Basavaraja, Ravi Kumar, Arup K. Das
An
effort has been made to understand the nucleate and the rapid
film boiling phenomena under the influence of an electric field using
a molecular viewpoint. The behavior of water molecules with a solid
copper surface during the film boiling process in the presence of
an electric field of different intensities has been studied. The molecular
reasoning behind the suppression of the Leidenfrost phenomenon upon
application of a uniform electric field along the heating substrate
is established. Furthermore, the effect of surface characteristics
with different wettabilities on film boiling in the presence of an
electric field has also been studied. The electric field produces
a finger-like water column besides thinning of the water film over
a non-wetting surface. A similar phenomenon is also evident over a
hydrophilic surface only after reaching a threshold value of electric
charge intensity. Molecular simulations have explained the phenomenon
of nucleate boiling of water on hydrophilic or non-wetting surfaces.
Finally, the ability to control the bubble formation and suppression
at a required location using an electric field has also been demonstrated.
The water molecules near the surface experience dispersion at a lower
electric field and an attraction force at a higher electric field,
mimicking bubble nucleation and suppression, respectively.