posted on 2020-01-27, 16:35authored byMaxime Harnois, Fatima Garcia-Castro, Gaëtan Herry, Olivier De Sagazan, France Le Bihan
We
developing technologies that aim to add flexible electronics
onto objects, researcher have to take into consideration environmental
issues such as plastic pollution. Faced with this challenge, the development
of technologies that comply with current standards such as WEEE (waste
electric and electronic equipment) legislation is crucial. Green electronics
based on fully biodegradable materials are under development but need
time to be put on the market. Meanwhile, inorganic electronics remain
a good candidate. Consequently, it makes sense to transfer inorganic
electronics onto objects that can be dismantled and recovered. Here,
an eco-designed technology allowing the transfer of electronics onto
objects is detailed. Silicon-based devices are transferred from polyimide
substrate (PI) to water-soluble substrate (PVA, poly(vinyl alcohol)).
It is highlighted that the transfer of inorganic layers from PI to
PVA substrate does not have a negative impact on the device’s
mechanical and electrical characteristics. To demonstrate such a concept,
we have transferred strain gauges and temperature sensors onto daily
life objects and achieved the same performance as sensors fabricated
onto polyimide substrate. Moreover, materials transferred onto the
object using PVA substrate can be dismantled and recovered at the
end of object’s life, highlighting that hydrosoluble substrate
is a good candidate for eco-designed technology.