Direct Writing on Copper Ion Doped Silica Films by Electrogeneration of Metallic Microstructures
journal contributionposted on 27.12.2016, 00:00 by Ahmed Kandory, Hélène Cattey, Lucien Saviot, Tijani Gharbi, Jackie Vigneron, Mathieu Frégnaux, Arnaud Etcheberry, Guillaume Herlem
A facile and rapid localized electrochemical reduction of colloid copper particles is proposed using the scanning electrochemical microscope (SECM) technique. In this purpose, thin films of composite silica glass containing copper salts were prepared by the sol–gel method via the dip coating technique. Acid-catalyzed tetraethylorthosilane (TEOS) solutions charged with copper nitrate were used as precursors. This one-pot experiment can be performed in mild conditions. The localized generation of copper metallic nanostructures on the silica film has been performed by electroreduction of methyl viologen on an ultramicroelectrode (UME). The UME generates reducing species, which in turn diffuse toward the silica matrix and reduce the metal ions. The diameter of the working electrode and the electrolysis period were taken into account to study the size of the generated dotted micropatterns. The compositions of the modified silica films were characterized by X-ray diffraction (XRD), scanning electronic microscopy (SEM), optical microscopy, and vibrational (IR-ATR and Raman) and X-ray photoelectron spectroscopies (XPS).
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X-ray photoelectron spectroscopiesTEOSsilica filmsmetal ionssilica glassXPSmicroscopydip coating techniquesilica filmIR-ATRscanning electrochemical microscopecopper saltsXRDcopper nitratecolloid copper particlessilica matrixUMESECMSEMMetallic Microstructuresone-pot experimentelectrolysis periodCopper Ion Doped Silica FilmsX-ray diffractionmethyl viologenelectrochemical reduction