posted on 1998-11-13, 00:00authored byVanessa Z.-H. Chan, Edwin L. Thomas, Jane Frommer, David Sampson, Richard Campbell, Dolores Miller, Craig Hawker, Victor Lee, Robert D. Miller
Thin films of silicon-containing polymers were studied to investigate changes in surface
composition and morphology on exposure to an oxygen plasma. For low molecular weight
poly(pentamethyldisilylstyrene) (P(PMDSS)), a reticulated structure was observed by atomic
force microscopy (AFM) that could limit future lithographic applications of these materials.
The reticulations were of approximately 1 μm in width and 5 μm in length, though a higher
molecular weight polymer resulted in smaller feature sizes. In polysilane polymers
containing silicon in the backbone and molecular weights significantly larger than the
entanglement molecular weight, the feature dimensions were even smaller. Films etched
at lower temperature (0 °C) displayed none of the reticulated morphology, retaining instead
the smooth appearance of pre-etched films. It was found by X-ray photoelectron spectroscopy
(XPS) and Auger electron spectroscopy (AES) that a thin (<100 Å) layer of SiOx formed on
the surface of all of the studied silicon-containing polymer films. Appearance of the
reticulated morphology required the combined presence of heating, oxygen plasma, and silicon
in the polymer. The reticulated structures are believed to result from the destabilization of
the thin films as they undergo the transition from a nonpolar organosilane to a polar oxide.