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Chemical Vapor Deposition Growth of Large Single-Crystal Mono‑, Bi‑, Tri-Layer Hexagonal Boron Nitride and Their Interlayer Stacking

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Version 2 2017-11-22, 13:07
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journal contribution
posted on 2017-11-03, 00:00 authored by Yanxin Ji, Brian Calderon, Yimo Han, Paul Cueva, Nicholas R. Jungwirth, Hussain A. Alsalman, Jeonghyun Hwang, Gregory D. Fuchs, David A. Muller, Michael G. Spencer
Two-dimensional hexagonal boron nitride (h-BN) is a wide bandgap material which has promising mechanical and optical properties. Here we report the realization of an initial nucleation density of h-BN <1 per mm2 using low-pressure chemical vapor deposition (CVD) on polycrystalline copper. This enabled wafer-scale CVD growth of single-crystal monolayer h-BN with a lateral size up to ∼300 μm, bilayer h-BN with a lateral size up to ∼60 μm, and trilayer h-BN with a lateral size up to ∼35 μm. Based on the large single-crystal monolayer h-BN domain, the sizes of the as-grown bi- and trilayer h-BN grains are 2 orders of magnitude larger than typical h-BN multilayer domains. In addition, we achieved coalesced h-BN films with an average grain size ∼100 μm. Various flake morphologies and their interlayer stacking configurations of bi- and trilayer h-BN domains were studied. Raman signatures of mono- and multilayer h-BN were investigated side by side in the same film. It was found that the Raman peak intensity can be used as a marker for the number of layers.

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