posted on 2024-04-11, 19:05authored byBowen Fang, Guixia Zhang, Fangxin Zou, Yan Wang, Baoping Dou, Hong Zhang, Jing Guo, Jiazhuang Xu
Effectively thermal conduction pathways are essential
for achieving
high thermal conductivity (TC) in polymer-based composites. While
constructing a segregated structure can yield high TC with low filler
loadings, traditional processing methods often have inherent drawbacks,
typically involving a complex preparation process and reduced mechanical
performance. In this study, a free-form was constructed based on the
full advantages of 3D printing. The composite with a dense segregated
structure was prepared by 3D printing a scaffold followed by filling
with a thermally conductive filler and then hot pressing. Furthermore,
boron nitride (BN) was chosen as the electrical insulating and thermally
conductive filler model, while graphene (GR) served as the electrical
and thermally conductive filler model. Benefiting from the interconnected
thermal conductivity network, the 3D-printed composites with GR exhibit
a high thermal conductivity of 3.82 W/mK, representing 2.81 times
that of composites with randomly blended fillers. Concurrently, these
composites also demonstrated robust mechanical properties, achieving
tensile strengths of up to 20.3 and 40.6 MPa, respectively, signifying
substantial improvements of 1.83 and 3.98 times over their randomly
blended counterparts. Therefore, this strategy provides the way for
the easy, effective, and universal preparation of thermally conductive
composites suitable for various insulated or electrical electronic
devices.