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Laser Sweeping Lithography: Parallel Bottom-up Growth Sintering of a Nanoseed–Organometallic Hybrid Suspension for Ecofriendly Mass Production of Electronics
journal contribution
posted on 2018-02-22, 00:00 authored by Jinho Yun, Minyang Yang, Bongchul KangWe present a novel
laser sweeping lithography (LSL) process, revolving
around an ecofriendly mass production method, to fabricate conductive
patterns in parallel with no restriction on the type of substrate.
Particle-free organometallic solution is reformulated in-process into
a nanoseed−organometallic hybrid suspension, via an incomplete
thermal decomposition using radiative heating. The growth sintering
undergoing a series of ion precipitation, clustering, growing, and
agglomeration procedures is then initiated by irradiating a line-modulated
diode laser of a near-infrared wavelength through a thermally enforced
laser mask on the hybrid suspension. This leads to the concurrent
parallel production of silver conductors with a high-conductivity
(2.9 μΩ·cm), durability, and resolution of 5 μm
on the corresponding to mask openings, without the need of any additional
steps and corrosive chemicals. This method is highly effective for
large-area fabrication of high-density electronics, as the production
time proportionally decreases with increased pattern density and area,
compared to conventional laser fabrication methods based on a single
laser spot. Therefore, the LSL process is suitable for ecofriendly
mass production of various electronic devices in industrial environments.
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5 μ mEcofriendly Mass Productionlaser masklaser spotion precipitationgrowth sinteringpattern densitynovel lasersilver conductorsecofriendly mass production methodradiative heatingParticle-free organometallic solutionagglomeration proceduresecofriendly mass productionLSL processmask openingsconductive patternsnear-infrared wavelengthlaser fabrication methodsline-modulated diode laserproduction timeParallel Bottom-up Growth Sintering
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