American Chemical Society
Browse
nn9b09105_si_001.pdf (1015.39 kB)

Interfacial Electromechanics Predicts Phase Behavior of 2D Hybrid Halide Perovskites

Download (1015.39 kB)
journal contribution
posted on 2020-02-25, 17:07 authored by Christopher C. Price, Jean-Christophe Blancon, Aditya D. Mohite, Vivek B. Shenoy
Quasi-two-dimensional (2D) mixed-cation hybrid halide perovskites (A′2AN–1MNX3N+1; A′ = large organic molecule with cationic group, A = [Cs+, CH3NH3+, HC­(NH2)2+], M = [Pb, Sn, Ge], X = [I, Br, Cl]) have rapidly emerged as candidates to improve the structural stability and device lifetime of 3D perovskite semiconductor devices under operating conditions. The addition of the large A′ cation to the traditional AMX3 structure introduces several synthetic degrees of freedom and breaks M–X bonds, giving rise to peculiar critical phase behavior in the phase space of these complex materials. In this work, we propose a thermodynamic model parametrized by first-principles calculations to generate the phase diagram of 2D and quasi-2D perovskites (q-2DPKs) based on the mechanics and electrostatics of the interface between the A′ cations and the metal halide octahedral network. Focusing on the most commonly studied methylammonium lead iodide system where A′ is n-butylammonium (BA; CH3(CH2)3NH3+), we find that the apparent difficulty in synthesizing phase-pure samples with a stoichiometric index N > 5 can be attributed to the energetic competition between repulsion of opposing interfacial dipole layers and mechanical relaxation induced by interfacial stress. Our model shows quantitative agreement with experimental observations of the maximum phase-pure stoichiometric index (Ncrit) and explains the nonmonotonic evolution of the lattice parameters with increasing stoichiometric index (N). This model is generalizable to the entire family of q-2DPKs and can guide the design of photovoltaic and optical materials that combine the structural stability of the q-2DPKs while retaining the charge carrier properties of their 3D counterparts.

History