am7b17018_si_001.pdf (1.32 MB)
High-Performance Graphene Sponges Reinforced with Polyimide for Room-Temperature Piezoresistive Sensing
journal contribution
posted on 2018-02-08, 00:00 authored by Jingxia Huang, Jinqing Wang, Zhigang Yang, Shengrong YangThe
bulk materials of three-dimensional graphene (3DG) with high network
structure and excellent electrical conductivity have many potential
applications in flexible electronics, but the network structure is
not very stable due to weak bonding between graphene nanosheets. Here,
a polyimide (PI) layer was introduced on the as-prepared 3DG sponge
by vacuum infiltration–curing method. The resulting 3DG/PI
composite sponges with robust 3D network structure exhibited an excellent
electrical conductivity (3.7 S/cm), compression strength (175 kPa),
elasticity, and flexibility, as well as outstanding compression sensitivity
to resistance and stable piezoresistance effect; namely, they possess
a large change in resistance in response to application of small strain
and low density, and the resistance change remains favorably stable
after performing 300 compress–release cycles, which means that
the prepared composite sponges can find wide applications in pressure-sensing
or stimulus-responsive graphene system.