10.1021/jacs.7b04347.s001
Lei Zhang
Lei
Zhang
Songlin Li
Songlin
Li
Marco A. Squillaci
Marco A.
Squillaci
Xiaolan Zhong
Xiaolan
Zhong
Yifan Yao
Yifan
Yao
Emanuele Orgiu
Emanuele
Orgiu
Paolo Samorì
Paolo
Samorì
Supramolecular
Self-Assembly in a Sub-micrometer Electrodic
Cavity: Fabrication of Heat-Reversible π‑Gel Memristor
American Chemical Society
2017
novel device concepts
adaptive nature
novel generation
π- gelator
Supramolecular Self-Assembly
nonsolid multiresponsive devices
fabrication
biomimetic approaches
Sub-micrometer Electrodic Cavity
Gel
dc bias
supramolecular self-assembly
sub-micrometer electrodic cavity
device platform
transition
novel gel-based memristor
2017-08-25 00:00:00
Journal contribution
https://acs.figshare.com/articles/journal_contribution/Supramolecular_Self-Assembly_in_a_Sub-micrometer_Electrodic_Cavity_Fabrication_of_Heat-Reversible_Gel_Memristor/5378083
The use of biomimetic approaches
toward the production of nonsolid
yet functional architectures holds potential for the emergence of
novel device concepts. Gels, in particular those obtained via self-assembly
of π-conjugated molecules, are dynamic materials possessing
unique (opto)electronic properties. Their adaptive nature imparts
unprecedented responsivity to various stimuli. Hitherto, a viable
device platform to electrically probe in situ a sol–gel transition
is still lacking. Here we describe the fabrication of a sub-micrometer
electrodic cavity, which enables low-voltage electrical operation
of π-gels. Thanks to the in situ supramolecular self-assembly
of the π-gelator occurring within the cavity, we conceived a
novel gel-based memristor whose sol–gel transition is reversible
and can be controlled via heating and dc bias. This work opens perspectives
toward the fabrication of a novel generation of nonsolid multiresponsive
devices.