10.1021/jacs.7b04347.s001 Lei Zhang Lei Zhang Songlin Li Songlin Li Marco A. Squillaci Marco A. Squillaci Xiaolan Zhong Xiaolan Zhong Yifan Yao Yifan Yao Emanuele Orgiu Emanuele Orgiu Paolo Samorì Paolo Samorì Supramolecular Self-Assembly in a Sub-micrometer Electrodic Cavity: Fabrication of Heat-Reversible π‑Gel Memristor American Chemical Society 2017 novel device concepts adaptive nature novel generation π- gelator Supramolecular Self-Assembly nonsolid multiresponsive devices fabrication biomimetic approaches Sub-micrometer Electrodic Cavity Gel dc bias supramolecular self-assembly sub-micrometer electrodic cavity device platform transition novel gel-based memristor 2017-08-25 00:00:00 Journal contribution https://acs.figshare.com/articles/journal_contribution/Supramolecular_Self-Assembly_in_a_Sub-micrometer_Electrodic_Cavity_Fabrication_of_Heat-Reversible_Gel_Memristor/5378083 The use of biomimetic approaches toward the production of nonsolid yet functional architectures holds potential for the emergence of novel device concepts. Gels, in particular those obtained via self-assembly of π-conjugated molecules, are dynamic materials possessing unique (opto)­electronic properties. Their adaptive nature imparts unprecedented responsivity to various stimuli. Hitherto, a viable device platform to electrically probe in situ a sol–gel transition is still lacking. Here we describe the fabrication of a sub-micrometer electrodic cavity, which enables low-voltage electrical operation of π-gels. Thanks to the in situ supramolecular self-assembly of the π-gelator occurring within the cavity, we conceived a novel gel-based memristor whose sol–gel transition is reversible and can be controlled via heating and dc bias. This work opens perspectives toward the fabrication of a novel generation of nonsolid multiresponsive devices.