High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material LoebleinManuela TsangSiu Hon PawlikMatthieu PhuaEric Jian Rong YongHan ZhangXiao Wu GanChee Lip Hang Tong TeoEdwin 2017 Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m<sup>–1</sup> K<sup>–1</sup>) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by Δ<i>T</i> of 44–24 °C).