Selective Electroless Copper Deposition on Self-Assembled Dithiol Monolayers
Dmitry Aldakov
Yvan Bonnassieux
Bernard Geffroy
Serge Palacin
10.1021/am8001346.s001
https://acs.figshare.com/articles/journal_contribution/Selective_Electroless_Copper_Deposition_on_Self_Assembled_Dithiol_Monolayers/2868760
The paper reports the use of self-assembled monolayers (SAMs) of dithiols to induce electroless copper deposition on a gold substrate. The metallization catalyst, palladium nanoparticles, is bound on the dithiol SAM. The assembly process is followed by IR and X-ray photoelectron spectroscopies to confirm the formation of a monolayer with bound catalyst. Electroless metallization is then carried out with a steady deposition rate of 130 nm/min. Additionally, microcontact printing of the catalyst on the SAM by poly(dimethylsiloxane) stamps is used to localize copper deposits. Resulting metallization is selective and allows for a high resolution.
2009-03-25 00:00:00
electroless copper deposition
copper deposits
deposition rate
gold substrate
Electroless metallization
palladium nanoparticles
microcontact printing
IR
metallization catalyst
assembly process
dithiol SAM
Selective Electroless Copper Deposition
monolayer
Resulting metallization